Thin film transistor array panel for liquid crystal display

ABSTRACT

A plurality of gate lines extending in a horizontal direction are formed on an insulating substrate, and a data line is formed perpendicular to the gate line thereby defining a pixel of a matrix array. Pixel electrodes receiving image signals through the data line are formed in a pixel, and a thin film transistor having a gate electrode connected to the gate line, a source electrode connected to the data line, and a drain electrode connected to the pixel electrode is formed on the portion where the gate lines and the data lines intersect. A storage wire including a storage electrode line is formed in the horizontal direction, and a storage electrode connected to the storage electrode line and forming a storage capacitance by overlapping the pixel electrode is formed in the pixel. A redundant repair line both ends of which overlap the storage wire of the neighboring pixel, and a storage wire connection line connecting the storage wires of a neighboring pixel are formed. In this structure, because the storage wires of a neighboring pixel are connected to each other through the storage wire connection line, the variation of the voltage for the storage capacitance may be minimized, and this results in a reduction of its distortion, such that crosstalk and flicker problems are minimized.

BACKGROUND OF THE INVENTION

[0001] (a) Field of the Invention

[0002] The present invention relates to a thin film transistor arraypanel for a liquid crystal display. More particularly, the presentinvention relates to a thin film transistor array panel for a liquidcrystal display having independent storage wires to form a storagecapacitance.

[0003] (b) Description of the Related Art

[0004] Liquid crystal displays (LCDs) are one of the most widely usedflat panel display (FPD) configurations. The liquid crystal display hastwo panels having electrodes for generating an electric field and aliquid crystal layer interposed between the two panels. Thetransmittance of incident light is controlled by the intensity of theelectric field applied to the liquid crystal layer.

[0005] In the most widely used liquid crystal displays, field-generatingelectrodes (common and pixel electrodes) are respectively formed on bothof the panels, and one of the panels has switching elements such as thinfilm transistors to control an image signal applied to the pixelelectrode.

[0006] A typical liquid crystal display uses a thin film transistor as aswitching element. Data lines and gate lines, which cross each other anddefine pixels in a matrix array, are formed on the panel on which thethin film transistors are disposed. Further, a pixel electrode, whichreceives an image signal from the data lines through the thin filmtransistor and generates an electric field with a common electrode, isformed in each pixel.

[0007] In the thin film transistor array panel for a liquid crystaldisplay, a storage electrode line is formed overlapping the pixelelectrode via an insulating layer and provides storage capacitance alongwith the pixel electrode to improve the capacitance of a liquid crystalcapacitor. Generally, a common signal applied to the common electrodeformed on another panel, or a gate signal applied to the gate line, isapplied to the storage electrode line.

[0008] However, during the operation of the liquid crystal display, thevoltage applied to the storage electrode is changed due to continuousvariation of image signals transmitted to the data line, and theresistance due to storage capacitance distorts a potential of thestorage electrode line. This results in a variation of liquid crystalcapacitance and an overall reduction in picture quality of the LCD as aresult of crosstalk and flicker problems that occur.

SUMMARY OF THE INVENTION

[0009] It is an object of the present invention to provide a thin filmtransistor panel for an LCD that reduces distortion of the voltageapplied to a storage electrode line such that crosstalk and flickerproblems are minimized.

[0010] It is another object of the present invention to provide a thinfilm transistor panel for an LCD having a wire structure such thatrepairs of wire open/short defects are easy.

[0011] These and other objects are provided, according to the presentinvention, by forming a redundant line at least connecting storage wiresof neighboring pixels to each other, and forming a redundant repair lineeach ends of which overlap the storage wire of a neighboring pixel.

[0012] In a thin film transistor array panel for a liquid crystaldisplay according to the present invention, a gate wire including gatelines is formed in a horizontal direction, a data wire including datalines which intersects and is insulated from said gate wire is formed ina vertical direction, and a pixel electrode which receives image signalsthrough the data line is formed in a pixel defined by an intersection ofthe gate line and the data line. A storage wire including storageelectrode lines and storage electrodes connected to the storageelectrode lines, and forming a storage capacitance by overlapping saidpixel electrode is formed, and a storage wire connection line at leastconnecting the storage wires of neighboring pixels is formed.

[0013] A redundant repair line ends of which overlap the storage wire ofa neighboring pixel may be formed.

[0014] It is desirable that the storage wire connection line is formedon the same layer as said pixel electrode, the redundant repair line isformed on the same layer as said data wire, and the storage wires areformed on the same layer as said gate wire.

[0015] Also, it is desirable that the storage wires overlap the edgeportion of the pixel electrode, and that the pixel electrode has shapesof a plurality of connected squares with rounded corners, an openingpattern in a square shape, saw-toothed shape or cross shape to alignliquid crystal molecules in a multi-domain configuration.

[0016] More concretely, a gate wire including a gate line transmitting ascanning signal in a horizontal direction, and a gate electrodeconnected to the gate line is formed on the insulating substrate, and astorage wire including a storage electrode line in a horizontaldirection and a storage electrode connected to the storage electrodeline is formed on the insulating substrate. A gate insulating layercovering said gate wire and said storage wire, and a semiconductor layermade of semiconductor material are formed. A data wire including a dataline formed in a vertical direction and defining a pixel of a matrixarray by intersecting the gate line, a source electrode connected to thedata line and extended on the semiconductor layer, and a drain electrodeextended on the semiconductor layer and separated from the sourceelectrode with respect to the gate electrode is formed, and apassivation layer covering the semiconductor layer is formed. A pixelelectrode electrically connected to the drain electrode in the pixel andforming a storage capacitance by overlapping the storage wire, and astorage wire connection line at least connecting the storage wire ofneighboring pixels are formed.

[0017] It is desirable that the pixel electrode and the storage wireconnection line are formed on the same layer as each other, and areformed on said passivation layer. Also, a redundant repair line formedon the same layer as the data wire with both ends overlapping thestorage wires of a neighboring pixel may be added.

BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings, which are incorporated in andconstitute a part of the specification, illustrate an embodiment of theinvention, and, together with the description, serve to explain theprinciple of the invention.

[0019]FIG. 1 is a wire view of a thin film transistor array panel for aliquid crystal display according to the first embodiment of the presentinvention.

[0020]FIG. 2 is a layout view of a thin film transistor array panel fora liquid crystal display according to the first embodiment of thepresent invention.

[0021]FIG. 3 is a cross-sectional view taken along line III-III′ of FIG.2.

[0022]FIGS. 4A to 4D are cross-sectional views of the thin filmtransistor array panel for the liquid crystal display of a manufacturingmethod according to the first embodiment of the present invention.

[0023]FIGS. 5A to 5G are cross-sectional views of the thin filmtransistor array panel for the liquid crystal display of anothermanufacturing method according to the first embodiment of the presentinvention.

[0024]FIG. 6 is a circuit view of a thin film transistor array panel fora liquid crystal display according to the first embodiment of thepresent invention.

[0025]FIG. 7 is a layout view of a thin film transistor array panel fora liquid crystal display according to the second embodiment of thepresent invention.

[0026]FIG. 8 is a cross-sectional view taken along line VIII-VIII′ ofFIG. 2.

[0027]FIG. 9 is a circuit view of a thin film transistor array panel fora liquid crystal display according to the second embodiment of thepresent invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0028] The present invention will be described more fully hereinafterwith reference to the accompanying drawings, in which preferredembodiments of the invention are shown. This invention may, however, beembodied in many different forms and should not be construed as limitedto the embodiments set forth herein. In the drawings, the thickness oflayers and regions are exaggerated for clarity. Like numerals refer tolike elements throughout. It will be understood that when an elementsuch as a layer, region, or substrate is referred to as being “on”another element, it can be directly on the other element or interveningelements may also be present. In contrast, when an element is referredto as being “directly on” another element, there are no interveningelements present.

[0029]FIG. 1 is a wire view of a thin film transistor array panel for aliquid crystal display according to the first embodiment of the presentinvention.

[0030] As shown in FIG. 1, in a thin film transistor array panel for aliquid crystal display according to the first embodiment of the presentinvention, a plurality of gate lines 22 transmitting a scanning signaland a plurality of data lines 62 transmitting a display signal or animage signal cross each other. The gate lines 22 and the data lines 62define a plurality of pixels in a matrix array. Each pixel includes apixel electrode 82 to which an image signal is applied through the dataline and a thin film transistor TFT. Gate and source and drainelectrodes of the thin film transistor TFT are respectively connected tothe gate line 22, the data line 62, the pixel electrode 82. Also, aplurality of storage electrode lines 26 and 28 that are parallel withthe gate line 22 and receives a voltage such as a common voltage appliedto a common electrode (not shown) on an upper panel of the liquidcrystal display are formed. The storage electrode lines 26 and 28 have adual-lined structure and are connected to each other through a storageelectrode 27, and they are parallel with the data line 62. The storagewires 26, 27 and 28 provide the storage capacitance by overlapping thepixel electrode 82. A storage wire connection line 84 at leastelectrically connecting storage wires 26, 27 and 28 of neighboringpixels is formed in a vertical direction, and a redundant repair line68, both ends of which overlap the storage wires 26, 27 and 28 andneighboring pixels is formed.

[0031] In the thin film transistor panel for a liquid crystal displayaccording to the present invention, because the storage wires 26, 27 and28 of neighboring pixels are at least connected to each other throughthe storage wire connection line 84, the variation of the voltage forthe storage capacitance, which is applied to the storage wires 26, 27and 28 may be minimized, and this results in reduction of itsdistortion, such that cross-talk and flicker problems are minimized.

[0032] Furthermore, in a thin film transistor panel for a liquid crystaldisplay according to the present invention, if the gate line 22 or thedata line 62 are respectively disconnected, the disconnection of wiremay be repaired by using the redundant repair line 68, the storage wires26, 27 and 28, and the storage wire connection line 84. This will bedescribed below while referring to FIG. 1.

[0033] For example, if the data line 62 is severed at portion A, the Cportions overlapping the data line 62 and the storage electrode lines 26and 28 on both sides of portion A are shorted using a laser, and the Bportions overlapping the storage electrode lines 26 and 28, and theredundant repair line 68 on the left side of portion A are shorted usinga laser. Accordingly, image signals transmitted to the severed data line62 are rerouted through the redundant repair line 68 and the storageelectrode lines 26 and 28. At this time, the D portions (represented byX) of the storage electrode lines 26 and 28 that are outside of bothsides of the portions between B and C are severed to prevent imagesignals from being transmitted to all of the storage wires 26, 27 and28.

[0034] As a further example, if the gate line 22 is severed at portionE, the F portion overlapping the gate line 22 and the storage wireconnection line 84 on the right side of portion E, and the H portionsoverlapping the redundant repair line 68 and the storage electrode lines26 on the left side of portion E are shorted using a laser,respectively. Accordingly, scanning signals transmitted to the severedgate line 22 are re-routed through the redundant repair line 68, thestorage electrode line 26, and the storage wire connection line 84. Atthis time, the G portions (represented by X) of the storage electrodeline 26 that are outside of both sides of the portions between the Hportion and the F portion, the storage electrode 27 connected to thestorage electrode line 26 between the F portion and the H portion, andthe storage wire connection line 84 between the F portion and thestorage electrode line 28 are severed to prevent scanning signals frombeing transmitted to all of the storage wires 26, 27 and 28. Theredundant repair line 68 may be only used to repair the disconnection ofthe gate line 22 without using the storage wire connection line 84.

[0035] Here, the redundant repair line 68 and the storage wireconnection line 84 may be formed on the same layer as each other and asthe pixel electrode 82 or the data line 62, or not. In the embodimentaccording to the present invention, the storage wires 26, 27 and 28 areformed on the same layer as the gate line 22, the redundant repair line68 is formed on the same layer as the data line 62, and the storage wireconnection line 84 is formed on the same layer as the pixel electrode82. This will be described in detail while referring to FIGS. 2 and 3.

[0036]FIG. 2 is a layout view of a thin film transistor array panel fora liquid crystal display according to the first embodiment of thepresent invention, and FIG. 3 is a cross-sectional view taken along lineIII-III′ of FIG. 2.

[0037] As shown in FIGS. 2 and 3, gate wires and storage wires of metalor conductive material such as aluminum (Al) or aluminum alloy,molybdenum (Mo) or molybdenum-tungsten (MoW), chromium (Cr), andtantalum (Ta) are formed on an insulating substrate 10. A gate wireincludes a gate line (or scanning signal line) 22 extending in thehorizontal direction in FIG. 1 and transmitting a scanning signal, and agate electrode 24 which is a part of the gate line and one terminal of athin film transistor. The gate wire may include a gate pad connected toan end of the gate line 22 and transmitting a scanning signal from anexternal circuit to the gate line 22. A storage wire includes storageelectrode lines 26 and 28, which are formed parallel to the gate line 22and has a dual structure, and a storage electrode 27 connecting thestorage electrode lines 26 and 28 to each other. It is provided with avoltage such as a common voltage applied to a common electrode (notshown) on an upper panel of the liquid crystal display. The storagewires 26, 27 and 28 provide storage capacitance along with a pixelelectrode 82, which will be described later, to improve the capacitanceof a liquid crystal capacitor.

[0038] The gate wire parts 22 and 24, and storage wire parts 26, 27, and28 may have a multiple-layered structure as well as a single-layeredstructure. When the gate wire parts 22 and 24 and storage wire parts 26,27, and 28 are formed of multiple layers, it is preferable that onelayer is made of a material having a low resistivity and another layeris made of a material having good contacting properties with othermaterials, particularly ITO (indium tin oxide), for the pixel electrode.This is because the wire and the ITO used for the pixel electrode areused together to reinforce the pad portions electrically connected tothe exterior.

[0039] A gate insulating layer 30 of silicon-nitride (SiNx) is formed ongate wire parts 22 and 24 and storage wire parts 26, 27, and 28, andcovers the same.

[0040] A semiconductor pattern 40 (made of a semiconductor such ashydrogenated amorphous silicon) is formed on the gate insulating layer30. Ohmic contact layer patterns 55 and 56 (made of such materials asamorphous silicon heavily doped with impurities like phosphorus) areformed on the semiconductor pattern 40.

[0041] Source and drain electrodes 65 and 66, made of conductivematerials such as Mo or MoW, Cr, Al or Al alloy, and Ta, are formed onthe ohmic contact layer patterns 55 and 56. A data line 62 formed on thegate insulating layer 30, extending in the vertical direction in FIG. 2,is connected to the source electrode 65 and defines a pixel along withgate line 22. The data wire parts 62, 65, and 66 may include a data padconnected to an end of data line 62. The data pad transmits imagesignals from an external circuit to the data line 62. Also, a redundantrepair line 68 each end of which overlaps the storage electrode lines 26and 28 of neighboring pixel column is formed in the vertical directionof FIG. 2 on the gate insulating layer 30, on the same layer as the datawire parts 62, 65, and 66. As above described, the storage wireconnection line 84 (referring to FIG. 1) may also be formed on the gateinsulating layer 30 on the same layer as the data wire parts 62, 65, and66 along with the redundant repair line 68.

[0042] The data wire parts 62, 65, and 66, and the redundant repair line68 may have a multiple-layered structure like the gate wire parts 22 and24 and storage wires 26, 27 and 28. Of course, when the data wire has amultiple-layered structure, it is preferable that one layer is made of amaterial having a low resistivity and another is made of a materialhaving good contacting properties with other materials.

[0043] A passivation layer 72 is formed on the data wire parts 62, 65,and 66 and the semiconductor pattern 40, which is not covered by thedata wire parts 62, 65, and 66. The passivation layer 72 has a contacthole 71 exposing the drain electrode 66, and contact holes 74 exposingthe storage electrode lines 26 and 28 along with the gate insulatinglayer 30. The passivation layer 72 can be made of an insulating materialsuch as SiNx, acrylic organic material, other transparentphoto-definable material, or other organic material.

[0044] The pixel electrode 82 that receives an image signal andgenerates an electric field with a common electrode of an upper panel isformed on the passivation layer 72. The pixel electrode 82 is made of atransparent conductive material such as indium tin oxide (ITO) or indiumzinc oxide (IZO), and is connected to the drain electrode 66 throughcontact hole 71. Also, a storage wire connection line 84 connecting theneighboring storage wires 26, 27, and 28 through the contact hole 74 ofthe passivation layer 72 and the gate insulating layer 30 is formed onthe same layer as the pixel electrode 82. On the other hand, thepassivation layer 72 may have contact holes exposing the gate pad andthe data pad, and redundant gate and data pads respectively connectingthe gate and data pads through the contact holes may be formed on thesame layer as the pixel electrode 82.

[0045] At this time, as shown FIG. 2, to use the storage wires 26, 27and 28 as a light blocking layer to block leakage light at the portionadjacent to the edge of the pixel electrode 82, it is preferable thatthe storage wires 26, 27 and 28 overlap a portion of the edge of thepixel electrode 82. To enhance a wide viewing angle of the LCD, it isdesirable that liquid crystal molecules are aligned in a multi-domainconfiguration. To obtain such a configuration, the pixel electrode 20may have various pixel division patterns. Here, the pixel electrode 20may have a plurality of connected squares with rounded corners, anopening pattern in a square shape, a saw-toothed shape or a cross shapeto align liquid crystal molecules in a multi-domain configuration byproviding a fringe field. To achieve the best viewing angle, it isdesirable that a unit pixel is divided into four domains. To achievestable division alignment, it is desirable that no disinclination oruneven texture is generated except at a boundary of the multi-domainregions, and it is preferable that directors of the liquid crystalmolecules in neighboring domains defined by the shapes are arranged at a90° angle. At this time, leakage light is generated by disinclination oruneven texture, and the storage wires 26, 27 and 28 may have variouspatterns. Of course, the common electrode (not shown) opposing the pixelelectrode 82 may have various opening patterns depending on the patternsof the pixel electrode 82.

[0046] In this structure according to the present invention, theredundant repair line 68 or the storage wire connection line 84 islocated at every pixel region, and may be located at every plurality ofpixel regions.

[0047] In these embodiments, transparent ITO is taken as an example ofthe material of the pixel electrode 82, but an opaque-conductivematerial may also be used in a reflective type liquid crystal display.

[0048] Next, the methods manufacturing the thin film transistor arraypanel for a liquid crystal display according to the first embodiment ofthe present invention will be described with referring the drawings.

[0049]FIGS. 4A to 4D are cross-sectional views of the thin filmtransistor array panel for the liquid crystal display of a manufacturingmethod according to the first embodiment of the present invention.

[0050] Firstly, as shown in IFG. 4A, a conductive layer having lowresistivity is deposited and patterned to form the gate wire partsincluding the gate line 22 and the gate electrode 24, and the storagewire parts including the storage electrode line 26 and 28, and thestorage electrode 27 (referring to FIG. 2) through a photolithographyprocess using a mask on an insulating substrate 10.

[0051] Next, as shown in FIG. 4B, a gate insulating layer 30 made ofinsulating material such as silicon nitride, a semiconductor layer 40made of semiconductive material such as amorphous silicon, and an ohmiccontact layer 50 made of conductive material such as a doped amorphoussilicon are sequentially layered by a chemical vapor deposition method,and the semiconductor layer 40 and the ohmic contact layer 50, which areboth island shaped, are formed on top of the gate electrode 24 and theopposing gate insulating layer 30 using a mask patterning process.

[0052] Next, as shown in FIG. 4C, a conductor layer having lowresistivity is deposited by such methods as sputtering and patternedthrough a photolithography process using a mask to form the data wires62, 65 and 66 (referring to FIG. 2) and the redundant repair line 68.

[0053] Then, the ohmic contact layer 50 is etched by using the datawires 62, 65 and 66 as a mask to divide the ohmic contact layer patterns55 and 56, and the semiconductor layer 40 between the source electrode65 and the drain electrode 66 is exposed.

[0054] Next, as shown FIG. 4D, a passivation layer 72 is formed bydepositing an inorganic insulator such as silicon-nitride (SiNx) orsilicon-oxide, or an organic insulator, and patterned along with thegate insulating layer 30 to form contact holes 71 and 74 respectivelyexposing the drain electrode 66 and the storage wires 26, 27 and 28(referring to FIG. 2).

[0055] Next, as FIGS. 2 and 3, a transparent conductive layer of IZO orITO is deposited and etched by photolithography using a mask to form thepixel electrode 82 and the storage wire connection line 84.

[0056] On the other hand, a method for manufacturing the thin filmtransistor array panel for a liquid crystal display according to anembodiment of the present invention using four masks will be describedwith referring to drawings.

[0057]FIGS. 5A to 5G are cross-sectional views of the thin filmtransistor array panel for the liquid crystal display of anothermanufacturing method according to the first embodiment of the presentinvention.

[0058] At first, as shown in FIG. 5A, a conductive layer having lowresistivity is deposited and patterned to form gate wire parts 22 and24, and a storage wire parts 26, 27 and 28 by dry or wet etching theconductive layer through a photolithography process.

[0059] Next, as shown in FIG. 5A, a gate insulating layer 30, asemiconductor layer 40, and an ohmic contact layer 50 are sequentiallydeposited respectively by such methods as chemical vapor deposition(CVD). Then, a conductor layer 60 is deposited by such methods assputtering and a photoresist layer having a thickness of 1 □ to 2 □ iscoated on the conductive layer 60.

[0060] Thereafter, the photoresist layer is exposed to light through asecond mask and developed to form photoresist patterns 112 and 114 asshown in FIG. 5B. At this time, the first portion 114 of the photoresistpattern located between a source electrode 65 and a drain electrode 66,i.e., a thin film transistor channel part C as shown in FIG. 5B, isthinner than the second portion 112 of photoresist pattern located overA portion where a data wire parts 62, 65, 66, and a redundant repairline 68 will be formed. Additionally, the third portion, or theremaining portion of the photoresist pattern located at portion B, isthinner than the first portion. The third portion may have a thicknessthat varies according to the etching method. For example, the thirdportion has substantially zero thickness when using a wet etch, but thethird portion may have a non-zero thickness when using a dry etch. Atthis time, the thickness ratio between the first portion 114 and thesecond portion 112 depends on the etch conditions which will bedescribed later. However, it is preferable that the thickness of thefirst portion 114 is equal to or less than half of that of the secondportion 112.

[0061] There are many methods to vary the thickness of the photoresistlayer according to position, and it is possible to control the amount ofincident light of a portion by forming a pattern such as a slit or alattice, or by providing a partly-transparent layer on the mask.

[0062] At this time, it is desirable that the size of the slit and theopaque portion between the slits are smaller than the resolution of theexposure device. When a partly-transparent layer is used, to reduce theamount of exposing light, a mask including films having differenttransmittances, or having a various thickness may be used.

[0063] When the photoresist layer is exposed to light through this mask,the polymers of the photoresist layer are disintegrated by the light.The exposure step is finished when the polymers of a portion, which isdirectly exposed to the light, are completely disintegrated. However,the polymers of the photoresist layer portion which are exposed throughthe slits pattern are not completely disintegrated because the amount ofincident light is less than that of the directly exposed portion. Thepolymers of the photoresist layer portion, which are not exposed tolight by blocking layer, are hardly disintegrated. After developing thephotoresist layers, the photoresist layer portion, which is hardlydisintegrated, is nearly remained, and a thinner portion is remainedunder the portion, which was exposed to a lesser amount of light thanthe portion, which received full exposure. However, if the exposure timeis too long, all the polymers of the photoresist layer aredisintegrated. Therefore, such over exposure should be avoided.

[0064] The thinner portion 114 may be formed by forming a photoresistlayer made of photosensitive and reflowable material, exposing thephotoresist layer to light through a mask having respectivelysubstantially transparent portions and substantially opaque portions toform a photoresist pattern having portions of zero and nonzerothicknesseses, and reflowing the photoresist to flow into the zerothickness portions to form a new photoresist pattern.

[0065] Referring back to FIG. 12C, the photoresist pattern 114 and thelayers thereunder including the conductor layer 60, the ohmic contactlayer 50, and the semiconductor layer 40 are next subjected to anetching process. When this is done, a data wire and a redundant repairline, and the layers thereunder at the A portion may be left, as well asonly the semiconductor layer on the channel part C. In addition, threelayers 60, 50, and 40 in the remaining part B are removed from the gateinsulating layer 30.

[0066] As shown in FIG. 5C, the ohmic contact layer 50 of the part B isexposed by removing the conductor layer 60 thereon. At this time, bothwet and dry etch can be used, and it is preferable that the etch isperformed under a condition such that the conductor layer 60 is etchedbut the photoresist layers 112 and 114 are not etched. However, since itis hard achieve this in the case of a dry etch, the etch may beperformed under a condition that the photoresist patterns 112 and 114 isalso etched. In this case, the first portion 114 may be made thickerthan in the wet etch case so that the conductor layer 60 is not exposed.

[0067] If the conductor layer 60 is made of Mo or MoW alloy, Al or Alalloy, or Ta, both dry or wet etch methods can be used. However, if theconductor layer 60 is made of Cr, a wet etch is better because Cr is noteasily removed by dry etch. CeNHO₃ is available as a wet etchant foretching a Cr conductor layer 60. The mixed gas system systems of CF₄ andHCl or CF₄ and O₂ is available for dry etching a Mo or MoW conductorlayer 60, and in this case, the etch rate of the latter system on thephotoresist layer is similar to that of the conductor layer 60.

[0068] Referring to FIG. 5C, as a result, only the portions of theconductor 67 and 68 under the photoresist layers 112 and 114 at thechannel part C and the A portion for source/drain electrodes and aredundant repair line are left, and the remaining portion of theconductor layer 60 at part B is wholly removed to expose the ohmiccontact layer 50 thereunder. At this time, the conductor patterns 67 and68 have the same layout as the data wire parts 62, 65, 66, and theredundant repair part 68 except that the source electrode 65 and thedrain electrode 66 are connected to each other. When a dry etch is used,the photoresist layers 112 and 114 are also etched to a certainthickness.

[0069] Next, the exposed portions of the ohmic conductor layer 50 atpart B, and the semiconductor layer 40 thereunder of FIG. 5D are removedby dry etching along with first portion 114 of the photoresist layer.The etch condition may be such that the photoresist patterns 112 and114, the ohmic contact layer 50 and the semiconductor layer 40 are alletched (the semiconductor layer and the ohmic contact layer have almostthe same etch rate), but the gate insulating layer 30 must be notetched. It is preferable that the etch rates of the photoresist patterns112 and 114 and the semiconductor layer 40 are almost the same. Thisoccurs, for example, with the mixed gas systems of SF₆ and HCl or SF₆and O₂. At this time, if the etch rates of the photoresist patterns 112and 114, the semiconductor layer 40 are almost the same, the thicknessof the first portion 114 is equal to or less than that of the sum of thesemiconductor layer 40, and the ohmic contact layer 50.

[0070] Then, as shown in FIG. 5D, the conductor pattern 67 is exposed byremoving the first portion 114 of the channel part C, and the gateinsulating layer 30 are exposed by removing the ohmic contact layer 50,and the semiconductor layer 40 of the part B. At the same time, thethickness of the second portion 112 over the A portion is reduced byetching. Furthermore, the completed semiconductor patterns 40 areobtained at this step.

[0071] The remaining photoresist layer on the conductor pattern 67 isthen removed by ashing or plasma etching.

[0072] Next, as shown in 5E, the conductor pattern 67 for source/drainelectrodes at the channel part C and the ohmic contact layer pattern 50for source/drain electrodes of FIG. 5E are removed by etching. At thistime, it is possible either to etch both the conductor pattern 67 andthe ohmic contact layer 50 by a dry etching method, or to etch theconductor pattern 67 by a wet etching method and the ohmic contact layer50 by a dry etching method. It is preferable in the former case thatetch conditions having large etch selectivity between the conductorpattern 67 and the ohmic contact layer pattern 50 are employed. This isbecause if the etch selectivity is not large enough, it is hard todetect the end point of the etch and to control the thickness of thesemiconductor pattern 40 around the channel part C. This can be achievedby using a mixed gas system of SF₆ and 02, for example. In the lattercase of doing the wet etch and the dry etch sequentially, the lateralsides of the conductor pattern 67 subjected to wet etch are also etchedalthough those of the ohmic contact layer pattern 50, which is dryetched, are hardly etched at all. Thereby, the profile of these twopatterns 67 and 50 makes a step like form. The mixed gas systems of CF₄and O₂, or CF₄ and HCl are examples of an etch gas system for etchingthe ohmic contact layer pattern 50 and the semiconductor pattern 40. Thesemiconductor pattern 40 may also be formed to have a uniform thicknessby etching with the mixed gas system of CF₄ and O₂. At this time, asshown in FIG. 5E, the thickness of the semiconductor pattern 40 may bereduced and the second portion 112 of the photoresist pattern is alsoetched to a certain thickness. The etch conditions may also be set notto etch the gate insulating layer 30, and it is preferable to make thephotoresist pattern thick enough not to expose the data wire parts 62,65, 66 and the redundant repair line 68.

[0073] As a result, the source electrode 65 and the drain electrode 66are divided, and the completed data wire parts 62, 65, 66, and theredundant repair line 68 and the completed contact layer pattern 55 and56 thereunder are obtained.

[0074] Next, the remaining second portion 112 of the photoresist layeron the data wire is removed. However, this removal of the second portion112 may be performed after the step removing the conductor pattern 67for source/drain electrodes on the channel part C and before the stepremoving of the ohmic contact layer pattern 50 under the conductorpattern 67.

[0075] To summarize, this process can be done by using both wet etchingand dry etching in turn, or by using only dry etching.

[0076] In the former case, the conductor layer of the part B is firstremove by wet etching, and then the ohmic contact layer and thesemiconductor layer thereunder are removed by dry etching. At this time,the photoresist layer of the part C is consumed to a certain thickness,and the part C may have or may not have any residual photoresist left,which substantially depends on the initial thickness of the photoresistlayer of the part C. When the part C has residual photoresist left, thisresidual photoresist is removed by ashing. Finally, the conductor layerof the part C is wet etched to separate the source and the drainelectrodes, and the ohmic contact layer of the part C is removed byusing dry etching.

[0077] In the latter case, the conductor layer, the ohmic contact layer,and the semiconductor layer of the part B are removed by dry etching. Asin the former case, the part C may have or may not have residualphotoresist left, and residual photoresist is removed by ashing whenpart C does have any residual photoresist. Finally, the conductor layerof the part C is dry etched to separate the source and the drainelectrodes, and the ohmic contact layer of the part C is removed byusing dry etching.

[0078] Also, if the data wire is etched, the semiconductor pattern, thecontact layer pattern, and the data wire may be completed with the samestep at one time. That is to say, it is desirable that the photoresistpattern 114 and the contact layer 50 thereunder of the part C are dryetched, and the portion of the photoresist pattern 112 of the part A isdry etched during the dry etching of the conductor layer, the ohmiccontact layer, and the semiconductor layer of the part B.

[0079] Since the latter process uses only one type of etching method, itis simpler, although it is harder to achieve proper etching conditions.On the other hand, the former process has the advantage of ease ofachieving proper etching condition, although it is more complicated.

[0080] After forming data wire parts 62, 65, 66, and the redundantrepair line 68 by the above steps, a passivation layer 70 is formed bysuch methods as chemical vapor deposition (CVD), as shown in FIG. 5F.

[0081] Next, the passivation layer 70 is patterned along the gateinsulating layer 30 through photolithography processes using a mask toform contact holes 71 and 74 exposing respectively the drain electrode66, and the storage wire, as shown in FIG. 5G.

[0082] Next, as above described, a IZO layer or a ITO layer is depositedand etched by using a mask to form a pixel electrode 82 connected to thedrain electrode 66. at this time, a storage wire connection line 84electrically connecting the storage wire 26, 27 and 28 of neighboringpixels through contact hole 74.

[0083] In the this embodiment having the same effects as that of thefirst embodiment, by forming the data wire parts 62, 65, 66, and theredundant repair line 68, the ohmic contact layer pattern 55, and 56,and the semiconductor patterns 40 through one photolithography process,the manufacturing method of the thin film transistor array panel may bealso simplified.

[0084] In this case, the semiconductor layer 40, the ohmic contact layerpattern 55 and 56 are formed according to the data wire 62, 65, 66, isdifferent from the structure of FIGS. 2 and 3. The ohmic contact layerpatterns 55, and 56 have the same layout as the data wire parts 62, 65,66. The semiconductor layer 40 except for channel portion between thesource electrode 65 and the drain electrode 66 has the same layout asthe data wire parts 62, 65 and 66, and the ohmic contact layer pattern55 and 56. Of course, a semiconductor layer and an ohmic contact layermay be remained under the redundant repair line 68.

[0085] This thin film transistor array panel according to the firstembodiment having the storage wire connection line may be used as onepanel of a liquid crystal display of twisted nematic (TN) mode orvertical align (VA) mode.

[0086]FIG. 6 is a circuit view of a thin film transistor array panel fora liquid crystal display according to the first embodiment of thepresent invention.

[0087] As shown in FIG. 6, a plurality of gate lines 22 transmitting ascanning signal and a plurality of data lines 62 transmitting a displaysignal or an image signal cross each other. The gate lines 22 and thedata lines 62 define a plurality of pixels in a matrix array. Each pixelincludes a thin film transistor TFT having a gate electrode 24 connectedto the gate line 22, a source electrode 65 connected to the data line62, and the drain electrode 65 connected to the pixel 82. Also, eachpixel includes a storage capacitor C_(st) generating storagecapacitance, and having two terminals of the pixel electrode 82 andstorage electrode lines 26 and 28 and a liquid crystal capacitor C_(LC)generating liquid crystal capacitance, and having two terminals of thepixel electrode 82 and a common electrode (not shown), which is formedon an upper panel of the liquid crystal display. A plurality of storagewire connection line 84 at least electrically connecting storage wires26, 27 and 28 of neighboring pixels is formed in a vertical direction.Here, the storage wire connection lines 84 are formed in each pixel.

[0088] On the other hand, a thin film transistor array panel for aliquid crystal display of in-plane switching mode (IPS) having pixelelectrodes and common electrodes, which are formed with the same panel,to form electrode field rearranging liquid molecules may be have astorage wire connection line at least electrically connecting storagewires of neighboring pixels, will be described with referring to FIGS. 7and 8.

[0089]FIG. 7 is a layout view of a thin film transistor array panel fora liquid crystal display according to the second embodiment of thepresent invention, and FIG. 8 is a cross-sectional view taken along lineVIII-VIII′ of FIG. 7.

[0090] As shown in FIGS. 7 and 8, gate wires and common wires of metalor conductive material are formed on an insulating substrate 10. A gatewire includes a gate line (or scanning signal line) 22 extending in thehorizontal direction in FIG. 7 and transmitting a scanning signal, agate electrode 24 which is a part of the gate line 22 and one terminalof a thin film transistor, and a gate pad connected to an end of thegate line 22 and transmitting a scanning signal from an external circuitto the gate line 22. A common wire includes common electrode lines 23and 29, which is formed parallel to the gate line 22 and has a dualstructure, and commons electrodes 21 connected to two storage electrodelines 23 and 29. The storage wires 23 and 29 provide storage capacitancealong with pixel electrode lines 63 and 69, which will be describedlater, to improve the capacitance of a liquid crystal capacitor.

[0091] A gate insulating layer 30 of silicon-nitride (SiNx) is formed ongate wire parts 22, 24 and 25 and storage wire parts 21, 23, and 29, andcovers the same.

[0092] A semiconductor pattern 40 (made of a semiconductor such ashydrogenated amorphous silicon) is formed on the gate insulating layer30. Ohmic contact layer patterns 55 and 56 (made of such materials asamorphous silicon heavily doped with impurities like phosphorus) areformed on the semiconductor pattern 40. Here, the semiconductor pattern40 is extended in the vertical direction according to a data line 62,which will be described later, and the portion of the semiconductorpattern 40 on which the gate line 22 and the data line 62 overlap toeach other is wider than the different portion of the semiconductorpattern 40 to minimize the disconnection of the data line 62.

[0093] Source and drain electrodes 65 and 66, made of conductivematerials are formed on the ohmic contact layer patterns 55 and 56. Thedata line 62 formed on the gate insulating layer 30, extending in thevertical direction in FIG. 7, is connected to the source electrode 65and defines a pixel along with gate line 22. The data wire parts 62, 65,and 66 includes a data pad 64 connected to an end of data line 62. Thedata pad transmits image signals from an external circuit to the dataline 62. Also, a pixel wire parts including pixel electrode lines 63 and69, which are extended in the horizontal direction and provide storagecapacitance by overlapping the common electrode lines 23 and 29, andpixel electrode 61, which is connected to the pixel electrode lines 63and 69 and generates electric field nearly parallel the substrate 10along with the common electrodes 21 to control liquid crystal molecules,is formed on the gate insulating 30. The pixel wire parts 61, 63 and 69are connected to the drain electrode 66. A redundant repair line 68 bothends of which overlap the common electrode lines 22 and 29 ofneighboring pixel column may be formed in the vertical direction of FIG.7 on the gate insulating layer 30, on the same layer as the data wireparts 62, 65, and 66. As above described, the storage wire connectionline 84 (referring to FIG. 1) may also be formed on the gate insulatinglayer 30 on the same layer as the data wire parts 62, 64, 65, and 66.

[0094] A passivation layer 72 is formed on the data wire parts 62, 64,65, and 66 and the semiconductor pattern 40, which is not covered by thedata wire parts 62, 64, 65, and 66. The passivation layer 72 has acontact hole 74 exposing the common electrode lines 23 and 29, contactholes 75 and 78 exposing the gate pad 25 and the data pad 64, contactholes 76 along with the gate insulating layer 30.

[0095] A redundant data wire parts made on conductive material such asmetal is formed on the passivation layer 72. The redundant data wireinclude a redundant data line 80 connected to the data line 62 throughcontact holes 76 and a redundant data pad 88 connected to the data pad64 through contact holes 78. Also, redundant gate pads 85, which areconnected to the gate pad 25 through contact hole 75, common wireconnection lines 84 connecting the neighboring common wires 21, 23, and29 through the contact hole 74 of the passivation layer 72 and the gateinsulating layer 30 are formed on the passivation layer 72. Theredundant data wire 80 and 88, and the redundant gate pad 85 may beformed of a transparent conductive material such as indium tin oxide(ITO) or indium zinc oxide (IZO) to improve reliability of pad portions.

[0096] Next, the methods manufacturing the thin film transistor arraypanel for a liquid crystal display according to the second embodiment ofthe present invention will be described with referring the drawings.

[0097] Most of a manufacturing method according to the second embodimentof the present invention is the same as that of the first embodiment.

[0098] However, the common wires 21, 23 and 29 are formed when formingthe gate wires 22, 24 and 25, and the pixel wires 61, 63 and 69 areformed when forming the data wire 62, 64, 65 and 66. Then, the redundantdata wires 80, 85 and 88 are formed on the passivation layer 72.

[0099]FIG. 9 is a circuit view of a thin film transistor array panel fora liquid crystal display according to the second embodiment of thepresent invention.

[0100] Most of a structure according to the second embodiment is thesame as that according to the first embodiment of FIG. 6.

[0101] However, two terminals of storage capacitors C_(st) and liquidcrystal capacitors C_(LC) are connected to the pixel wires 63 and 69,and the common wires 23 and 29, respectively.

[0102] In the present invention, by forming the storage wire connectionline at least connecting the storage wires of neighboring pixels to eachother, the variation of the voltage for the storage capacitance may beminimized, and this results in a reduction of distortion such thatcrosstalk and flicker problems are minimized. Also, by using theredundant repair line and the storage wire connection line, open defectsof the gate line and the data line may be easily repaired.

[0103] In the drawings and specification, there have been disclosedtypical preferred embodiments of the present invention and, althoughspecific terms are employed, they are used in a generic and descriptivesense only and not for purposes of limitation, the scope of theinvention being set forth in the following claims.

What is claimed is:
 1. A thin film transistor array panel for a liquidcrystal display, comprising: a gate wire including gate lines formed ina horizontal direction; a data wire including data lines formed in avertical direction, wherein said data wire intersects and is insulatedfrom said gate wire; a pixel electrode formed in a pixel defined by anintersection of the gate line and the data line, receiving image signalsthrough the data line; a storage wire including storage electrode linesand storage electrodes connected to the storage electrode lines, whereinthe storage wire forms a storage capacitance by overlapping said pixelelectrode; and a storage wire connection line at least connecting thestorage wires to a neighboring pixel.
 2. The thin film transistor arraypanel of claim 1, further comprising a redundant repair line each end ofwhich overlaps the storage wire of a neighboring pixel.
 3. The thin filmtransistor array panel of claim 2, wherein the storage wire connectionline is formed on the same layer as said pixel electrode.
 4. The thinfilm transistor array panel of claim 1, wherein said redundant repairline is formed on the same layer as said data wire.
 5. The thin filmtransistor array panel of claim 1, wherein said storage wires are formedon the same layer as said gate wire.
 6. The thin film transistor arraypanel of claim 1, wherein said storage wire overlaps an edge portion ofthe pixel electrode.
 7. The thin film transistor array panel of claim 1,wherein the pixel electrode has a plurality of connected squares withrounded corners, an opening pattern in a square shape, saw-toothed shapeor cross shape to align liquid crystal molecules in a multi-domainconfiguration.
 8. A thin film transistor array panel for a liquidcrystal display, comprising: an insulating substrate; a gate wire formedon the insulating substrate, wherein said gate wire includes a gate lineformed in a horizontal direction and transmitting a scanning signal, anda gate electrode connected to the gate line; a storage wire formed onthe insulating substrate, wherein said storage wire includes a storageelectrode line formed in a horizontal direction, and a storage electrodeconnected to the storage electrode line; a gate insulating layercovering said gate wire and said storage wire; a semiconductor layerformed on the gate insulating layer and made of semiconductor material;a data wire including a data line formed in a vertical direction, asource electrode connected to the data line and extended on thesemiconductor layer, and a drain electrode extended on the semiconductorlayer and separated from the source electrode with respect to the gateelectrode, wherein the data line defines a pixel of a matrix array byintersecting the gate line; a passivation layer covering saidsemiconductor layer; a pixel electrode formed in the pixel andelectrically connected to the drain electrode, wherein said pixelelectrode forms a storage capacitance by overlapping the storage wire;and a storage wire connection line at least connecting the storage wireof neighboring pixels.
 9. The thin film transistor array panel of claim8, wherein the pixel electrode and the storage wire connection line areformed on the same layer as each other.
 10. The thin film transistorarray panel of claim 7, wherein the pixel electrode and the storage wireconnection line are formed on said passivation layer.
 11. The thin filmtransistor array panel of claim 6, further comprising a redundant repairline each end of which overlaps the storage wires of a neighboring pixeland which is formed on the same layer as the data wire.